Product Overview   · Low profile and thin quad flat packages (QFP)   are classified by the overall thickness (t)   according to JEDEC definition:   L type: 1.2< t <=1.7 mm   T type: 1< t <=1.2 mm · Low profile and thin QFPs are becoming popular, as   they are they are ideal for applications in lightweight   and portable electronic products. ASE KR offers   LQFP/TQFP packages in lead counts ranging from 32   to 256 and 44 to 128 respectively, covering almost all   the applications in memory, DSP, and communication   ICs. Due to the low electrical parasitic out of the   small outline and shorter leads, low and thin QFPs are   suitable for RFICs and an economical alternative to   QFPs. Features   · Wide selection of pad size to meet die requirements · Customized leadframe design capability · 44~176 leads counts available · Fine pitch wirebond capability · Pb free process ready and available · High conductivity copper leadframes · Low stress die attach materials · Power enhancement version · JEDEC standard compliance · Cu wire bonding   Key Features  Package size (mm)  10x10 ~ 20x20  Lead count available  LQFP : 32 ~ 256, TQFP : 44 ~176

© 2015 ASE Korea, Inc. All Rights Reserved. Terms of Use