· Low profile and thin quad flat packages (QFP)
are classified by the overall thickness (t)
according to JEDEC definition:
L type: 1.2< t <=1.7 mm
T type: 1< t <=1.2 mm
· Low profile and thin QFPs are becoming popular, as
they are they are ideal for applications in lightweight
and portable electronic products. ASE KR offers
LQFP/TQFP packages in lead counts ranging from 32
to 256 and 44 to 128 respectively, covering almost all
the applications in memory, DSP, and communication
ICs. Due to the low electrical parasitic out of the
small outline and shorter leads, low and thin QFPs are
suitable for RFICs and an economical alternative to
QFPs.