Product Overview ASE KR’s WLCSP solution provides customers with the opportunity to meet demanding time-to-market demands. ASE KR's goal is to provide the most cost effective and reliable WLCSP package solution possible to all our customers. Features   · Real chip size (smallest, thinnest and lightest) · High density interconnection · High speed data processing · Batch process - assembly processed in wafer form · 8 inch and 12 inch WLCSP are available   Key Features Die Size (mm) < 6x6 Ball Pitch (mm) 0.3 ~ 0.5 Ball Diameter (mm) 0.17 ~ 0.35 Package Height (mm) 0.35 ~ 1.0

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