Product Overview ASE KR’s FBGA (Fine Pitch Ball Grid Array) is a laminate substrate based CSP and near chip-size standard outlines and an array of fine pitch solder ball terminals. The FBGA package uses standard assembly technology and established SMT mounting processes and techniques are compatible with it. This package provides downsized outline and high dense design with low inductance for high-speed application requiring small footprints. ASE KR’s FBGA is available in lead free and halogen free compatible material sets and JEDEC standard body sizes. Features   The total thickness of the package Very Fine Pitch (VFBGA) BGA can go as low as 1.0 mm due to significant improvement in substrate and die thinning technology.    · Rigid & customized routing substrate design    · High density interconnection    · Full in-house design capability    · Fine Pitch wire bond capability    · Low assembly cost    · Self-alignment during re-flow    · High speed performance    · Lead Free & Green Package process and available    · Ease of thermal and electrical management    · Ease of routing   Key Features(1)    LFBGA  TFBGA  VFBGA  Package size (mm)  3x3~21x21  3x3~21x21  3x3~21x21  Ball count available  25~676  25~676  25~676  Substrate  2/4 (BT)  2/4 (BT)  2/4 (BT)  Overall thickness (mm)  1.2 < H <= 1.7  1.0 < H <= 1.2  0.8 < H <= 1.0  Ball pitch (mm)  0.5 / 0.75 / 0.8 /  1.0  0.5 / 0.75 / 0.8 /  1.0  0.4 / 0.5 / 0.75 /  0.8   Key Features(2)    WFBGA  UFBGA  XFBGA  Package size (mm)  3x3~14x14  3x3~14x14  3x3~14x14  Ball count available  25~676  25~676  25~676  Substrate  2 /4 (BT)  2 /4 (BT)  2 /4 (BT)  Overall thickness (mm)  0.65 < H <= 0.8  0.5 < H <= 0.65  0.4 < H <= 0.5  Ball pitch (mm)  0.4 / 0.5 / 0.75 /  0.8  0.4 / 0.5 / 0.75 /  0.8  0.4 / 0.5 /  0.65 © 2015 ASE Korea, Inc. All Rights Reserved. Terms of Use