ASE KR’s FBGA (Fine Pitch Ball Grid Array) is a laminate substrate based CSP and near chip-size standard outlines and an array of fine pitch solder ball terminals. The FBGA package uses standard assembly technology and established SMT mounting processes and techniques are compatible with it. This package provides downsized outline and high dense design with low inductance for high-speed application requiring small footprints. ASE KR’s FBGA is available in lead free and halogen free compatible material sets and JEDEC standard body sizes.