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Product Overview

ASE KR’s MCP(Multi-Chip Package) employs thin core substrate and wafer thinning technology so as to provide multi-die structures for increased device functionality while maintaining size reduction. It provides efficient use of motherboard and allows for size and weight reduction as well as cost reduction needs of system level.


· Thinner profile with dies stacking platform
· Compatible with standard FBGA infrastructures and footprints
· Thinner spacer technology
· Wire bonding on die overhang
· Wafer thinning and handling to 75um

Key Features
 Wafer Thickness (mm)  Min. 0.075
 Substrate  2 / 4 (BT)
 Solder Ball Pitch (mm)  Min. 0.4

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