Product Overview   Imbedding a passive element such as a capacitor, register, inductor to interior of a substrate can make high integration, high confidence and also especially can make thin, light and small size.  · High density glass / ceramic multilayer technology  · Allows direct attach of silicon and GaAs integrated    circuits.  · Parallel processed technique all layers produced    separately and co-fired in single process. Features    · High dielectric constant  · Shorter electrical length, small size  · Lower dielectric loss  · Stable electrical properties at high frequency and environmental change  · Each layer inspected prior to stacking  · Multiple layer structure  · Allows innovative printed structure  · Miniaturization  · LTCC(Low temperature Co-fired Ceramics)   Key Features  Package size (mm)  3.8 x 3.0 ~ 45 x 45  Ball count available  110 ~ 1520  Substrate  2 / 4 / 6 (BT)  Overall thickness (mm)  0.75 ~ 2.33  Ball pitch (mm)  1.0 / 1.27 / 1.5

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