Product Overview   PQFN which is also called PLLP(Power Lead Less Package in ASEKR) demand is expected to emerge from multi-functional power and Automotive electronics to meet requirements for high performance and High reliability of package due to increase operating life time. Features   · Excellent Thermal, Electrical and Mechanical performances · Capable of Package in Package design · Available Square or Rectangular body design · Lead free plating available (pure tin) · Multi chip solution in a package to increase functionality · Small leadless footprint requires less board space · High flexibility in design for combined die bond methodology · Capable heavy gauge AL wire bonding · Saw or Punch singulated package format · Large leadframe (250 X 70 mm)   Key Features  Package size (mm)  2x2 ~ 10x10  Lead count available  8 ~ 108  Leadframe  Ag and PPF plated  Overall thickness (Saw/Punch, mm)  0.45 / 0.85  Lead pitch (mm)  Min. 0.4

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