· High temperature solder material
· Custom package available
· Getek/BT/FR4 multi-layer substrate material
· Substrate material (Coreless, ENEPIG)
· Multi-chip Module
· Electrical / Thermal Conductive epoxy
· High Density Integration(01005 passive, Fine pitch wire bond, Low-K wafer)
· Fine trace line & space
· System integrated Package
· Green Solution
· Super Large Strip (240.5 X 74.12 mm)