Product Overview In case of SiP module, quite often, a protective casing like metal lids or over-mold encapsulation is included in order to provide mechanical protection and implement EMI shielding at package-level. Package-level shielding solution can provides - Performance: More predictable and less influenced by   external components - Design Cycle: Reduce cycle time by eliminating   retuning process - Production: Reduce manufacturing steps And, full-cut   conformal shield provides better shield effectiveness   and cost advantage than half-cut conformal shield and   metal lid solution Packages   · RF module · SiP module · Memory

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