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Shielding solution

Product Overview

In case of SiP module, quite often, a protective casing like metal lids or over-mold encapsulation is included in order to provide mechanical protection and implement EMI shielding at package-level. Package-level shielding solution can provides
- Performance: More predictable and less influenced by
  external components
- Design Cycle: Reduce cycle time by eliminating
  retuning process
- Production: Reduce manufacturing steps And, full-cut
  conformal shield provides better shield effectiveness
  and cost advantage than half-cut conformal shield and
  metal lid solution


· RF module
· SiP module
· Memory

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