In case of SiP module, quite often, a protective casing like metal lids or over-mold encapsulation is included in order to provide mechanical protection and implement EMI shielding at package-level. Package-level shielding solution can provides
- Performance: More predictable and less influenced by
external components
- Design Cycle: Reduce cycle time by eliminating
retuning process
- Production: Reduce manufacturing steps And, full-cut
conformal shield provides better shield effectiveness
and cost advantage than half-cut conformal shield and
metal lid solution