Product Overview Land Grid Array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantages over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5mm) and lighter CSP. Features    · Thinner, lighter and smaller CSP  · Mature standard matrix BGA assembly process  · Space reduction in system level  · Pb free solution  · Excellent electrical an thermal performance   Key Features  Package size (mm)  2x2 ~ 15x11  Lead Count available  12 ~ 102  Substrate  2 / 4 / 6 (BT)  Overall Thickness (mm)  Max. 1.56  LGA pitch (mm)  Min. 0.5 © 2015 ASE Korea, Inc. All Rights Reserved. Terms of Use