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Product Overview

Land Grid Array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantages over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5mm) and lighter CSP.



 · Thinner, lighter and smaller CSP
 · Mature standard matrix BGA assembly process
 · Space reduction in system level
 · Pb free solution
 · Excellent electrical an thermal performance

Key Features
 Package size (mm)  2x2 ~ 15x11
 Lead Count available  12 ~ 102
 Substrate  2 / 4 / 6 (BT)
 Overall Thickness (mm)  Max. 1.56
 LGA pitch (mm)  Min. 0.5

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