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PBGA

 
Product Overview

· PBGA is the general terminology for the BGA package
  adopting plastic (epoxy molding compound) as the
  encapsulation. According to JEDEC standard, PBGA
  refers to an overall thickness of over 1.7mm.
· ASE KR's BGA design and features improve the
  performance of graphics, PLDs, DSPs, PC chipsets,
  communications, networking,
  microprocessors/controllers, ASIC, gate arrays and
  memory packages.

Features
 

· 15x15 mm to 45x45 mm package
· 119 balls to 1520 ball count
· High interconnect density
· Self-alignment during reflow
· Low profile
· Ease of thermal and electrical management
· Ease of routing
· Good power dissipation
· JEDEC MS-034 standard outlines
· Pb free process available

 
Key Features
 Package size (mm)  15 x15 ~ 45 x 45
 Ball count available  110 ~ 1520
 Substrate  2 / 4 / 6 (BT)
 Overall thickness (mm)  1.61 ~ 2.33
 Ball pitch (mm)  1.0 / 1.27 / 1.5



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