· PBGA is the general terminology for the BGA package
adopting plastic (epoxy molding compound) as the
encapsulation. According to JEDEC standard, PBGA
refers to an overall thickness of over 1.7mm.
· ASE KR's BGA design and features improve the
performance of graphics, PLDs, DSPs, PC chipsets,
communications, networking,
microprocessors/controllers, ASIC, gate arrays and
memory packages.