Product Overview Heat slug BGA(HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance() of PBGA without change of material. The of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates(e.g. 2 or 4 layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs. Features   · 15x15 mm to 45x45 mm package · 120 balls to 1520 ball count · Cost effective · Good electrical / thermal performance · Good power dissipation · JEDEC MS-034 standard outlines · Pb free process available   Key Features  Package size (mm)  15 x15 ~ 45 x 45  Ball count available  120 ~ 1520  Substrate  2 / 4 / 6 (BT)  Overall thickness (mm)  1.61 ~ 2.33  Ball pitch (mm)  1.0 / 1.27 / 1.5

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