Product Overview Flipchip Module package incorporating one or horizontally- arranged multi-chip die with SiP package format. Moderate Fully-functional subsystem package consisting of a substrate, one or more die, chip-level interconnects, integrated or surface-mounted passive and active components and protective casing (RF shield, lid, overmold, etc). Features   · Lower ground inductance, Fine bump pitch · Overall improved electrical performance.   (RF gain, noise, linearity, power consumption) · Assembly compatibility · Lower cost & small size · Cu pillar bump to enhance the thermal performance. · Lower Pin Count & High Performance   Key Features  Package Size (mm)  3x3 ~ 13x13  Package Thickness (mm)  0.85~1.8  Substrate  2/4/6L/Build-up  Bump Type  High-Pb / Pb-free / Cu-pillar

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