Thermally enhanced FCBGA, is the composite package of FCBGA with heatspreader made of Cu, Al, or AlSiC. This method desensitizes the performance deviation out of the chip size, lowers the thermal resistance of junction-to-case (θJC) and enables the external heat sink or fan to work more effectively. HFCBGA can produce 6~8 watts of power dissipation under natural convection.