Product Overview With gold prices fluctuating, wire bonding using copper is becoming more and more attractive. In addition to its cost advantages, copper wire bonding has the attributes of lower electrical resistance and better thermal characteristics. Copper wire bonding, with wire diameter of 50 micron and above, has been well established for power device applications. The challenge facing copper wire bonding today is to replace gold wire for application at about 25 microns in diameter where the majority of wirebond application lie. ASE’s copper wire bonding initiatives is geared towards this group of applications. Bonding pad composition and wafer structure are the major factors for copper wire evaluation, and ASE can customize products based on specific customer needs. Applications   · Copper Wire can apply to existing QFP, QFN, BGA products © 2015 ASE Korea, Inc. All Rights Reserved. Terms of Use