모집기간 : 2021-05-11~2021-07-30

담당업무
1. In-process quality engineering for various package(CIS/WLCSP/Module/LGA/BGA/Flipchip/Memory etc)
2. Problem solving and follow up of actions
3. Continuous quality improvement actvity
4. Customer complaint handling

자격요건
1. Bachelor degree in electronic/Industrial/material/mechanical engineering
2. 3~5 years of experience working in semicoductor related company (substrate packaging)
3. Fluent in English to write, read and communicate
4. Problem solving method (8D/5Why/DMAIC) & statistical basic method (SPC)
5. Understanding of basic quality system(ISO/IATF16949)
6. Good interpersonal relation