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ASE KOREA TOP > Quality Management > Failure Analysis
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Failure Analysis
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Failure Analysis
Product Analysis
Non-destructive Analysis
- Real time 2D & 3D X-ray
- Scanning Acoustic Microscope
- Low & High Power Microscopes
- Package Warpage Measurement
Characteristics Analysis
- Curve Tracer
- Automatic I/O Test System
- Digital Oscilloscope
- Time-Domain Reflectometer
- Semiautomatic Probe Station
Cross Section & De-processing
- Ion Polisher
- Ion Milling
- Precision Grinder
- Multi Grinder
- Molding Press
- Automatic Polisher
- Laser Decapsulator
- Chemical hood for Manual Deprocessing
SEM/EDX Analysis
- Scanning Electron Microscope
- Field Emission-SEM
- Energy Dispersive X-ray
- Coating machine
External Lab.
- Micro Structure Analysis: FIB, SEM, TEM
- Wafer Level Analysis: EMMI, RIE, FE-SEM
- Surface/Material Analysis: Auger, XPS, SIMS, FT-IR, & Others