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Design Service

  Package & Technology Development

ASE Korea provides complete engineering service from package development to volume production thru process/material characterization. This is done to improve reliability, reduce production cycle time, and reduce manufacturing cost without compromising product quality. And ASE Korea offers a full suite of assembly solutions to meet IC packaging needs.

   - Project Management
   - Mutual Communication
   - Development of a First Article
   - Novel Packaging Solution
   - Cost Competitiveness : Wide Strip & Cu Wire

  Package Design

Provides full package design as turn key solution, meeting customer’s requirements for not only electrical requirements but also RF characteristics.

Full-Service Packaging Design Centers

Design services

   - RF-SiP
   - EPD (Embedded passive Design)
   - FC module
   - Chip stack design
   - PoP, PiP
   - LGA,BGAs
   - QFP, TQFP
   - Discrete devices
Design tools

   - Cadence APD
   - Autodesk : Auto cad
   - Downstream : Cam350

ASE Korea’s virtual simulation for electrical simulation provides stable performance for high speed design & RF designs, reduces potential error by minimizing trial & error for optimal design.

Provides states of art design solution with cooperation with Group R&D

Flexibility of design documentation for variety of engineering samples


  Package Electrical Simulation

Since the needs of semiconductor device for higher frequency operation, higher speed signal is growing quickly; electrical simulation capability has significance for solving critical issue without waste of time and cost.

ASE Korea provides electrical characteristic design and analysis for optimal IC package design in terms of high-frequency / high-speed analysis, power integrity analysis and signal integrity analysis technology.

ASE Korea experts in electrical design solution is concentrating upon improvement, verification and optimizing electrical package designs including following items:

Service Provided

1. Quasi-static parasitic extraction (RLC) of critical traces,
   Max / min traces and whole package
2. Power/ground inductance extraction
3. Cross-talk / coupling, over/under shoot, timing analysis
4. Characteristic impedance control / analysis
5. Single-mode / mixed-mode S-parameter analysis
6. TDR / TDT Analysis
7. Power integrity analysis
8. Signal integrity analysis
9. Substrate integrity design and analysis
10. Customer specific design analysis

Modeling and simulation tools

   - HFSS for high frequency structure simulator
   - Q3D, Q2D for Quasi-static EM solver
   - TPA for BGA (Wire-bond, Flip-chip) packages
   - Ansoft links for CAD data import/interface
   - ADS Schematics for circuit design simulation
   - ADS Momentum for co-simulation of circuit and PCB

Electrical Characterization data for customer

   - Equivalent lumped RLC data and coupling coefficient
   - S-parameter data in numerical and graphic format
   - Z-parameter data in numerical and graphic format
   - Characteristic impedance data
   - IBIS and Spice package models
   - Power and ground noise, bouncing
   - Package E-field, H-field plot
   - Simultaneous switching noise (SSN)


  Package Mechanical & Thermal Simulation
Stress & Reliability Characterization

The stress & reliability characterization is used to analyze the stress issues and package reliability by numerical simulation and measurement. The analysis also consists of root cause investigation into packaging failure (like die crack, delamination) and optimal design for low stress and high reliability. The characterization also provides component and system-level stress analysis to predict the fatigue life of solder joints, like temperature-cycle-test (TCT), bending test, and other reliability tests. The characterization services include

Thermal Stress Characterization

   - Warpage & component stress prediction
   - Packaging material selection & structure design
   - Package level reliability analysis

Solder bump/ joint shape prediction

Board Level Reliability Test and Simulation

   - Temperature cyclic test
   - Bend cyclic test
   - Drop test
   - Solder joint reliability (fatigue) prediction
Thermal Characterization

As operating frequency is getting higher and transistors shrink to nanometer regime, the power densities of devices become higher and higher. The needs for small form factor and functional integration (MCM/SiP) make thermal management more challenging. ASE Korea can provide simulation and measurement services that help our customers to overcome thermal issues. These services include

In pre-design phase

   - Package recommendations
   - External heat sink effect evaluations
   - Simple package thermal resistance calculator

In design phase

   - Design effect
   - Hot spots impact evaluations
   - Customized heat sink effects
   - Transient analyses for power pulse impacts

In post-design phase

   - Thermal measurements

Thermal measurements include the measurements for package thermal parameters and material thermal conductivities

   - (Junction-to-ambient thermal resistance)
   - (Junction-to-case thermal resistance)
   - (Junction-to-board thermal resistance)
   - (Junction-to-top thermal characterization parameter)
   - (Junction-to-board thermal characterization parameter)

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