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Package Electrical Simulation |
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Since the needs of semiconductor device for higher frequency operation, higher speed signal is growing quickly; electrical simulation capability has significance for solving critical issue without waste of time and cost.
ASE Korea provides electrical characteristic design and analysis for optimal IC package design in terms of high-frequency / high-speed analysis, power integrity analysis and signal integrity analysis technology.
ASE Korea experts in electrical design solution is concentrating upon improvement, verification and optimizing electrical package designs including following items:
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Service Provided |
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1. Quasi-static parasitic extraction (RLC) of critical traces,
Max / min traces and whole package
2. Power/ground inductance extraction
3. Cross-talk / coupling, over/under shoot, timing analysis
4. Characteristic impedance control / analysis
5. Single-mode / mixed-mode S-parameter analysis
6. TDR / TDT Analysis
7. Power integrity analysis
8. Signal integrity analysis
9. Substrate integrity design and analysis
10. Customer specific design analysis
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Modeling and simulation tools |
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- HFSS for high frequency structure simulator
- Q3D, Q2D for Quasi-static EM solver
- TPA for BGA (Wire-bond, Flip-chip) packages
- Ansoft links for CAD data import/interface
- ADS Schematics for circuit design simulation
- ADS Momentum for co-simulation of circuit and PCB
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Electrical Characterization data for customer |
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- Equivalent lumped RLC data and coupling coefficient
- S-parameter data in numerical and graphic format
- Z-parameter data in numerical and graphic format
- Characteristic impedance data
- IBIS and Spice package models
- Power and ground noise, bouncing
- Package E-field, H-field plot
- Simultaneous switching noise (SSN)
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