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ASE Group Overview & Executives

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC packaging, design and production of interconnect materials, frond-end engineering test, wafer probing and final test as well as electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group.

  ASE’s services fall into two categories: ICs and systems

- IC Services
Material :Substrate design and manufacturing
Test : Engineering test, wafer probing and final test
Assembly : Package and module design, wafer bumping, chip packaging (or assembly), multi-chip assembly, micro and hybrid module assembly

- System Services
  Module-to-systems product offerings and design-to-distribution total solutions

Advanced Technologies and Processes
  Chip designers continue to pack more functions onto a shrinking chip size and demanding better performance, and greater speed. This increasing complexity of the integrated chip has posed much challenge to the manufacturing process. In keeping with the advances in chip development, ASE maintains a highly experienced and skilled engineering team that continuously research and develop the latest assembly technologies. ASE also invests prudently in the latest equipment and state-of-art facilities, making us a true extension of our customers’ manufacturing operations. As an industry leader, ASE was the first to achieve volume production for Cu Wire Bonding, Wafer Bumping, Flip Chip, Wafer-Level Chip Scale Package (WLCSP), Cu Pillar Bump, Stacked Die Packaging, and System in Package (SiP), MEMS Packaging, Green Packaging and 300mm turnkey backend solutions. Customers are the direct benefactors of this lead in advanced technology.

ASE’s Strategic Worldwide Deployment
  With worldwide manufacturing bases and over 58,000 employees (including USI), ASE Group subsidiaries are strategically located in Taiwan, South Korea, Japan, Singapore, Malaysia and China, Mexico as well as the Americas and Europe. In addition to our bases in the world's key centers for semiconductor manufacturing, our customer service and sales offices cover major semiconductor markets throughout the rest of the world. The comprehensive manufacturing and service capabilities offered by ASE Group enable us to offer customers a high degree of flexibility and efficiency. We provide engineering test, package design, assembly, wafer probing, final test and design manufacturing services (DMS).

ASE’s Turnkey Services
  The scope and depth of ASE’s manufacturing value chain enables the company to provide complete semiconductor turnkey solutions. Services from engineering test, wafer probing, package design, substrate design and manufacturing, packaging, testing, and shipping are fully integrated onto a single supply chain.

Location of Manufacturing Facilities
  _ Kaohsiung, Taiwan
_ Chungli, Taiwan
_ Nantou, Taiwan
_ Singapore
_ Paju, Korea
_ Takahata, Japan
_ Penang, Malaysia
_ Shanghai, China
_ Shenzhen, China (USI)
_ Weihai, China (Discrete)
_ Fremont, California & Austin, Texas (ISE Labs Inc.)

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