Product Overview   Comparing to normal QFN package, Open cavity QFN(OQFN) needs “Pre-mold” and “Glass lid attach”. After pre-molding, it takes die bonding and wire bonding, and normal molding process is substituted by glass lid attach. Features   · Applicable for Mega pixel image · Cost effective solution · In-house glass sawing (Plain, IR coated for AR coated) · In-house transfer molding · Strip-form assy handling · Green solution · MSL 3 at 260 Deg.C · Gross leak guarantee · Excellent thermal performance · Effective solder joint monitoring at board mounting · 1.55 mm nominal · Cu lead frame base · Ni/Pd/Au plating · Epoxy die attach · Au wire w/down bonds · Transfer molding · Plain glass lid or IR/AR coated glass lid · Leadless form factor   Key Features  Package size (mm)  10 x 10  Cavity size (mm2)  6.72  Die pad size (mm2)  5.2  Lead pitch (mm)  0.80  Lead Paddle Size (mm2)  0.3

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