Product Overview Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications. Features   · Substrate : 4 layer laminate, 4~8 layer build-up, and ceramic, substrates are   available for different applications. · Passive Component: Passive component attaching is available. It can be placed on   the top or bottom side of the package. · Ceramic BGA: High Pb solder ball with eutectic solder paste improves board level   reliability performance of ceramic packages.   Key Features  Package Size (mm)  13x13 ~ 50x50  Package Thickness (mm)  Max. 0.8  Substrate  2 / 4 / Build-up  Die Size (mm)  Max. 18x18  Bump Type  Eutectic / High Pb / Leadfree / Cu pillar bump  Solder ball  SAC405 / SAC305 / SAC105 / SAC125

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