Home | SiteMap | Contact Us | Korean
Products

 

ASE KR prides itself as a leader in IC packaging and test by providing a total solution from wafer probe, substrate design and manufacturing, packaging, test and module assembly. We possess the required expertise in product and advanced process technology for the manufacture of CSP, MCM/stacked-die/3D, thermally enhanced packages, high frequency packages, flip chip packages, wafer bumping, and wafer level CSP. The collaboration among affiliated companies within the ASE Group has enabled us to vertically link up activities across the manufacturing value chain. ASE KR’s one-stop solution gives our customers clear benefits of improved time-to-market and total cost management. Covering all existing and developing IC packages available at ASE KR, this product information provides detailed descriptions of the performance, package outline, characterization data, standard processes, and materials of each product.

  New Technology
  •  
      3D Packaging
     
      WLP
     
      SiP
     
      Flipchip Technology
     
      Laminate Base
     
      Leadframe Base
     
      Ceramic Base
     



    © 2015 ASE Korea, Inc. All Rights Reserved. Terms of Use