Introduction   In high density and speed integrated circuit, the most restrict problem is the noise by electromagnetic crosstalk (sometimes called coupling). This noise is called crosstalk noise, generally and this coupling is classified into by electric and magnetic field, respectively. In view of circuit, the coupling by electric and magnetic field can be modeled as mutual capacitance and inductance, respectively. For the most case coupling noise is dominated by the noise resulted from capacitance, and in particular the inner crosstalk noise of chip mostly can be modeled by only using mutual capacitance. But in case of package the coupling resulted from magnetic field sometimes need to be considered. A thing worthy of note is that because the magnetic coupling is difficult to expect shielding effectiveness it must be considered in case of multiple conductor existing. If magnetic coupling don't be negligible as it is difficult to derive the model of closed form, generally by simulation the noise is analyzed. The purpose of electrical simulation for IC packaging is to perform detailed analysis on equivalent parasitic extraction for the interconnection from bonding wire to pin. The requirements for IC packaging could be listed as: high-speed/high-frequency with analog and digital signal contents, fast design cycle-time with best quality. For an IC assembly house, the numerical analysis is necessary at the development stage. This analysis enables engineers to optimize the electrical performance by modifying materials or structure inside a package. Not only does simulated data suitable for preprocess design, it is also beneficial for designers to select the fittest package to meet their requirements. Capabilty   _ To extract package RLC _ Parametric analysis _ EM field analysis