As performance of higher power density of package is more demanded, limited component temperature is one of the major problems which have to be solved in order to obtain highly reliable and low cost product. Power dissipation will result in temperature difference and pose a thermal problem to a chip. In addition to reliability issue, excess heat will also have negative effects on electrical performance and safety. Recently, thermal simulation of electronic package is necessary at the development stage for electronic package assembly using commercial FEM software ANSYS which enables engineers to optimize the thermal performance by modifying materials or structure inside a package.
Not only does simulated data suitable for preprocess design, it is also beneficial for designers to select the fittest package to meet their requirements. Also it can give a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal behavior of the package depending on the material properties and package geometry.
Introduction
