As an electronic package is comprised of very various materials, such as silicon chip, molding compound, leadframe, and epoxy die attach, it would encounter various stress-related problems during different processes. Generally an abrupt temperature change in processing will induce stress concentration problems and warpage due to different coefficient of thermal expansion (CTE). In addition, the adhesion strength between different materials, the geometry of package, and mechanical properties of materials are all points of concerns for electronic packaging.
These thermal stress and strains in electronic packaging components and systems with various materials are very difficult to obtain. The finite element method (FEM) can be out of the best candidates for obtaining approximate results fort the thermal stresses and deformations in electronic packages and interconnects. Mechanical simulation serves the solution for package and chip failures which can occur during process using ANSYS which is commercial FEM software.
Capabilty
_ To predict warpage and delamination
_ To evaluate package stresses, solder plastic strain under thermal and mechanical loading
_ To evaluate optimum package design and material selection
Introduction
