ASE Korea, Semiconductor Assembly & Test Turn-key solution provider, services various package design solutions with most cost effective & reliable ways. Metal (Lead frame) Based Package Design   _ Automotive power product : HSOP, SIP, TQFP, LQFP, PQFP, etc. _ Sensor product : SOIC, SSOP, SOP, NSOP, etc. _ CSP : BCC, BCC+, BCC++, QFN, Power QFN(PLLP), etc. _ Pre-molded product : Applied to QFN, Power QFN(PLLP), etc. Laminated PCB Based Package Design   _ SIP (RF module) _ CSP : LGA, BGA Customer Oriented Package Design   _ ASE Korea R&D center also provides various customer oriented special    package solutions with mechanical, thermal & electrical simulation results. Design Tools   _ AUTO-CAD (Latest Version) _ AUTO-CAD Mechanical Power Pack _ AIS (AUTO-CAD Inventor Series) _ Solid Works _ CAM 350 _ APD (Advanced Package Design Solution)