Building High Integrity Interfaces in Packages   High-integrity interfaces between different materials such as substrate epoxy molding compound and die adhesive used in packaging semiconductors are critical to our continued business success. Delaminated package between the interfaces during solder reflow processing at package mounting process directly caused electrical failure, which is associated with wire broken, die crack or solder extrusion. Especially high-integrity interfaces are essential in achieving green package requiring higher solder reflow up to 260'C. We provide advanced technical solutions to build high integrity interfaces focusing the following subjects and satisfy our customers.  _ High bonding quality and quantity  _ Chemistry of epoxy molding compound, die adhesive, solder mask, etc.  _ Design consideration of package and substrate  _ Characteristics of adherents and adhesives  _ Physical characteristics of package  _ Vacuum molding technology  _ Plasma cleaning technology  _ Laser surface cleaning technology  _ Optimization of process parameters and environments