FC BGA
Overview

Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.
Features
 

กค Substrate:4 layer laminate, 4~8 layer build-up, and ceramic, substrates are
  available for different applications.
กค Passive Component: Passive component attaching is available. It can be
  placed on the top or bottom side of the package.
กค Ceramic BGA: High Pb solder ball with eutectic solder paste improves board
  level reliability performance of ceramic packages.

 
Key Features
 Pkg. Size  13x13 ~ 50x50 mm2
 Pkg. Thickness  0.8mm max.
 Substrate  2L/4L/Build-up
 Die Size  Max. 18x18mm
 Bump  Eutectic/ high Pb /Leadfree /Cu pillar bump
 Solder ball  SAC405/ SAC305 / SAC105 / SAC125