FC BGA

Overview

Laminate or build-up organic substrate offers better electrical performance than wire-bond type BGA package especially in high frequency applications.

Features

бд Substrate:4 layer laminate, 4~8 layer build-up, and ceramic, substrates are available for different applications.
бд Passive Component: Passive component attaching is available. It can be placed on the top or bottom side of the package.
бд Ceramic BGA: High Pb solder ball with eutectic solder paste improves board level reliability performance of ceramic packages.


Key Features

Package size (mm)	11x11 ~ 40x40
Ball count available	100 ~ 1521
Substrate	2 / 4 / 6 (BT)
Overall thickness (mm)	-
Ball pitch (mm)	1.0 / 1.27