Imbedding a passive element such as a capacitor, register, inductor to interior of a substrate can make high integration, high confidence and also especially can make thin, light and small size.
 ， High density glass / ceramic multilayer technology
 ， Allows direct attach of silicon and GaAs integrated circuits.
 ， Parallel processed technique all layers produced separately and co-fired in single process.

 ， High dielectric constant
 ， Shorter electrical length, small size
 ， Lower dielectric loss
 ， Stable electrical properties at high frequency and environmental change
 ， Each layer inspected prior to stacking
 ， Multiple layer structure
 ， Allows innovative printed structure
 ， Miniaturization
 ， LTCC(Low temperature Co-fired Ceramics)