Imbedding a passive element such as a capacitor, register, inductor to interior of a substrate can make high integration, high confidence and also especially can make thin, light and small size.
， High density glass / ceramic multilayer technology
， Allows direct attach of silicon and GaAs integrated circuits.
， Parallel processed technique all layers produced separately and co-fired in single process.

， High dielectric constant
， Shorter electrical length, small size
， Lower dielectric loss
， Stable electrical properties at high frequency and environmental change
， Each layer inspected prior to stacking
， Multiple layer structure
， Allows innovative printed structure
， Miniaturization