Product Overview

Heat slug BGA(HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance() of PBGA without change of material. The of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates(e.g. 2 or 4 layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs.
Features
 

， 15x15 mm to 45x45 mm package
， 120 balls to 1520 ball count
， Cost effective
， Good electrical / thermal performance
， Good power dissipation
， JEDEC MS-034 standard outlines
， Pb free process available
 
Key Features
 Package size (mm)  15 x15 ~ 45 x 45
 Ball count available  120 ~ 1520
 Substrate  2 / 4 / 6 (BT)
 Overall thickness (mm)  1.61 ~ 2.33
 Ball pitch (mm)  1.0 / 1.27 / 1.5