FBGA
PBGA
PBGA
Product Overview

， PBGA is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
， ASE's BGA design and features improve the performance of graphics, PLDs, DSPs, PC chipsets, communications, networking, microprocessors/controllers, ASIC, gate arrays and memory packages.
Features
 

， 15x15 mm to 45x45 mm package
， 119 balls to 1520 ball count
， High interconnect density
， Self-alignment during reflow
， Low profile
， Ease of thermal and electrical management
， Ease of routing
， Good power dissipation
， JEDEC MS-034 standard outlines
， Pb free process available
， Good power dissipation
 
Key Features
 Package size (mm)  15 x15 ~ 45 x 45
 Ball count available  110 ~ 1520
 Substrate  2 / 4 / 6 (BT)
 Overall thickness (mm)  1.61 ~ 2.33
 Ball pitch (mm)  1.0 / 1.27 / 1.5