FBGA
PBGA
FBGA
Product Overview
 

ASE¨s FBGA (Fine Pitch Ball Grid Array) is a laminate substrate based CSP and near chip-size standard outlines and an array of fine pitch solder ball terminals. The FBGA package uses standard assembly technology and established SMT mounting processes and techniques are compatible with it. This package provides downsized outline and high dense design with low inductance for high-speed application requiring small footprints. ASE¨s FBGA is available in lead free and halogen free compatible material sets and JEDEC standard body sizes.

 
A<=1.0 1 1.2
B<=0.8 VFBGA TFBGA LFBGA
B>0.8 VBGA TBGA LBGA
 
Key Features
   L(F)BGA  T(F)BGA  V(F)BGA
 Package size (mm)  8x8 ~ 19x19  6x6 ~ 18x18  7.29 ~ 6.96
 Ball count available  64 ~ 256  64 ~ 256  47 ~ 148
 Substrate  2 / 4 (BT)  2 (BT)  2 (BT)
 Overall thickness (mm)  1.2 ~ 1.6  1.0 ~ 1.2  <= 1.0
 Ball pitch (mm)  0.8 / 1.0  0.5 / 0.75 / 0.8 / 1.0  0.5 / 0.75 / 0.8
Features (VF BGA)
 

The total thickness of the package Very Fine Pitch (VFBGA) BGA can go as low as 1.0 mm due to significant improvement in substrate and die thinning technology.
   ， Rigid & customized routing substrate design
   ， High density interconnection
   ， Full in-house design capability
   ， Fine Pitch wire bond capability
   ， Low assembly cost
   ， Self-alignment during re-flow
   ， High speed performance
   ， Lead Free & Green Package process and available
   ， Ease of thermal and electrical management
   ， Ease of routing

Features (TF BGA)
 

TFBGA is an ideal solution to the requirements of both dense layout and small outline for ICs of I/O counts of less than 329. Four-layer BT substrates are available for these packages to provide better electrical characteristics. TFBGA technology was developed for space reduction. This type of package has chip size solution based on mature laminated substrate technology and material.
   ， Memory assembly available
   ， MCM package available

Features (LF BGA)
 

Low & Thin BGA is an ideal solution to meet requirements of both dense layout and small outline for ICs of I/O counts of less than 288. Four-layer BT substrates are available for these packages to provide better electrical characteristics. Low & Thin BGA was developed for space reduction. This type of package is a chip size solution based on mature laminated substrate technology and material.
   ， Fine pitch technology development
   ， MCM package available