LGA
SIP
BGA
SIP
Product Overview

ASEKR's SiPs incorporate the most advanced assembly process and design for recent cost / performance applications. This advanced IC package technology allows application and design while maximizing the RF performance characteristics. ASEKR's SiPs feature two or more active dies (Silicon, SiGe and GaAs) and their associated 50 ohm matching network. ASEKR's SiPs are designed for low inductance, enhanced SMT ability and Custom designs with higher performance along with long-term reliable operation.

Features
 

， High temperature solder material
， Custom package available
， Getek/BT/FR4 multi-layer substrate material
， LTCC(Low temperature Co-fired Ceramics)
  substrate material
， Multi-chip Module
， Electrical / Thermal Conductive epoxy
， High Density Integration(01005 passive, Fine pitch wire bond, Low-K wafer)
， Fine trace line & space
， System integrated Package
， Green Solution
 
 Package size (mm)  3x3 ~ 13x13
 Lead count available  24 ~ 72
 Substrate  4 / 6 (BT)
 Overall thickness (mm)  Max. 1.6
 LGA pitch (mm)  Min. 0.5