, High temperature solder material
, Custom package available
, Getek/BT/FR4 multi-layer substrate material
, Substrate material (Coreless, ENEPIG)
, Multi-chip Module
, Electrical / Thermal Conductive epoxy
, High Density Integration(01005 passive, Fine pitch wire bond, Low-K wafer)
, Fine trace line & space
, System integrated Package
, Green Solution
, Super Large Strip (240.5 X 74.12 mm)