BCC (bump chip carrier) uses plating metal pads (so-called "terminals", as small as 0.4X0.3mm) to connect with the PCB. The terminals, which are etched from copper-based lead frame during packaging process, can be placed on the periphery of package with in-line or staggered layout. BCC+ & BCC++ both have exposed die pads, which can be soldered to PCB. This direct heat path can enhance the thermal performance. BCC++ additionally intensifies the electrical performance by allocating a ground ring, which is extended from the die pad, to allow wire bonding. This common ground can reduce the ground inductance and curb the inductive noise. The BCC packages are competent to the applications over 12GHz

， Small package size, light weight.
， Package height 0.8mm max.
， Existing BOM and process flow.
， Excellent Thermal performance
， Excellent Electrical performance
， Suitable for high frequency application.
， Customer-designable
， Capable Multi/stack chip solution for functionality
， Dual row(staggered) lead available
， JEDEC standard compliant
， Green solution