Comparing to normal QFN package, Open cavity QFN(OQFN) needs ＾Pre-mold￣ and ＾Glass lid attach￣. After pre-molding, it takes die bonding and wire bonding, and normal molding process is substituted by glass lid attach.

， Applicable for Mega pixel image
， Cost effective solution
， In-house glass sawing (Plain, IR coated for AR coated)
， In-house transfer molding
， Strip-form assy handling
， Green solution
， MSL 3 at 260 Deg.C
， Gross leak guarantee
， Excellent thermal performance
， Effective solder joint monitoring at board mounting
， 1.55 mm nominal
， Cu lead frame base
， Ni/Pd/Au plating
， Epoxy die attach
， Au wire w/down bonds
， Transfer molding
， Plain glass lid or IR/AR coated glass lid
， Leadless form factor