Quad
Product Overview
 

， Low profile and thin quad flat   packages (QFP) are classified by   the overall thickness (t) according   to JEDEC definition:
  L type: 1.2< t <=1.7 mm
  T type: 1< t <=1.2 mm

， Low profile and thin QFPs are becoming popular, as they are they are ideal for   applications in lightweight and portable electronic products. ASE offers   LQFP/TQFP packages in lead counts ranging from 32 to 256 and 44 to 128   respectively, covering almost all the applications in memory, DSP, and   communication ICs. Due to the low electrical parasitic out of the small outline   and shorter leads, low and thin QFPs are suitable for RFICs and an economical   alternative to QFPs.

Features
 


， 10x10mm to 20x20mm body size available
， Wide selection of pad size to meet die requirements
， Customized leadframe design capability
， 44~176 leads counts available
， Fine pitch wirebond capability
， Pb free process ready and available
， High conductivity copper leadframes
， Low stress die attach materials
， Power enhancement version
， JEDEC standard compliance

 
Key Features
 Package size (mm)  
 Lead count available