The Power Lead-Less Package in ASE Korea was demonstrated for high thermal performance and multi-functionality application using a leadframe as the substrate, which improve thermal performance for the Automotive and Power drive component applications. The package configuration is available in a number of formats by customer requirements. It is compliant package per JEDEC MO-251 standards.
Features
， Superior thermal performance with thick Cu lead frame
， Direct thermal path between the die and the package heat sink.
， Multi-chip solution in a package to increase functionality
， Excellent package integration
， Wide applications : Communication / Power device
， Customized design & Process
， Combine solder and/or Epoxy die attach material for Power and control die
， Package thickness 1mm ~ 2.1mm
， Use Heavy gauge AL wire and/or Au wire bonding
， Sawn/Punched type
， Lead frame base material option : Ag plated Cu/PPF Cu
Product Overview
