TSSOP
PFP(Plastic Flat Package)
HSIP
PSOP
HSIP
Product Overview

The amplifier design is a dual power op amp on a single monolithic die. This approach provides a cost-effective solution to applications where multiple amplifiers are required or a bridge configuration is needed. Very low harmonic distortion of 0.02% THD and low IQ makes the PA60 a good solution for low power audio applications such as laptops and computer speakers.
Features
 

， Copper Wire Bonding Capable Up To 2mil
， Auto Mount & Full Auto Dicing Saw
， Solder Die Attachment
， Pre-Plated Leadframe(Ni/Pd or Ni/Pd/Au) and also provide post plating service.
， Gold Wire Ball Bond Up To 3mil
， Copper Wire Bonding Capable Up To 2mil
， Auto mold
， Moisture Sensitivity Level 1 Capable
， In-Line Marking, Trim and Form with Vision Systems
， Various lead form Options
， Lead free package at 260 C re-flow