Mark LaPedus
EE Times
(06/29/2009 11:53 EDT)

SAN JOSE, Calif. -- Taiwan's Advanced Semiconductor Engineering Inc. (ASE) has signed a syndicated loan agreement with 17 banks. The five-year loan is worth NT$12 billion ($364.7 million).
The proceeds from the syndicated loan will be used to repay loans due before June 2010 and for working capital, according to ASE (Taipei, Taiwan), the world's largest IC packaging house.

 The loan is led by Citibank, Taipei Fubon Commercial Bank, Bank of Taiwan, Calyon Corporate and Investment Bank and First Commercial Bank. Other syndicated loan participating banks include China Development Industrial Bank, Changhwa Commercial Bank, Chinatrust Commercial Bank, Taiwan Cooperative Bank, Cathay United Bank, Mega Commercial Bank, Yuanta Commercial Bank, E.Sun Commercial Bank, Hua Nan Commercial Bank, Bank of Tokyo Mitsubishi, Shin Kong Commercial Bank and Shanghai Commercial & Savings Bank.