Christoph Hammerschmidt
EE Times Europe
(11/23/2007 6:04 $ EST)

The orders include several production mask aligners and coat/bake/develop clusters for 200-mm and 300-mm wafers. The machines will be installed at ASE's wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.

"Driven by market demands for faster, smarter, portable and integrated electronic products, we are increasingly moving towards more sophisticated semiconductor applications," said D.Y. Chen vice president of advanced packaging operations, ASE Kaohsiung. Critical success factors are throughput, yield, and cost effectiveness, Chen pointed out.

Suss did not elaborate on the value of the contract. However, the company said it was about a "significant" volume.