ASE announced it will be showcasing System in Package (SiP) solutions in consumer applications at Computex 2015, scheduled to take place in Taipei, Taiwan, over June 2-6, 2015. These SiP applications highlight the synergy between ASE’s IC packaging, material and test technologies, together with the strong expertise of Universal Scientific Industrial Shanghai Co, Ltd (USI; SHA) in module level manufacturing services to bring SiP into the realm of IoT.

SiP technology enables multiple semiconductor chips and passive components to be integrated within a smaller and more compact module without compromising the functionality and performance of the entire package or module. Hence, SiP can be ideally applied to many of today’s consumer technologies that require heterogeneous integration of numerous IC functions such as RF, processor, memory, sensors, power management, multimedia, and more, within very tight space constraints.

ASE’s developments in SiP also serve to protect the environment as it reduces the number of required manufacturing steps. Previously, each device function was developed onto individual IC chips, but with SiP technology, the ICs can be designed and directly embedded onto a substrate, then onto a module. The reduction in manufacturing steps results in less required materials as well as increased efficiency in logistics management during inventory shipment.

To better serve the fast-growing IoT segment, ASE has evolved its business model by combining its technologies in wire bonding, wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded IC packaging with USI’s module level assembly to establish a strong leadership in SiP. ASE has also created a cohesive ecosystem for its SiP platform that included a key announcement with Inotera Memories Inc (April 7, 2014) on foundry service for 2.5D silicon interposer and TDK Corporation (May 8, 2015) for proprietary embedded substrate manufacturing. The collaboration within the supply chain has led to the development of a world class manufacturing technology that can be used in embedded solutions within smartphones, wearables, homes, connectivity and sensor applications.