Product Overview ASE KR's Power Modules can provide the physical containment for several power components and Power semiconductor devices in one package. These power semiconductors are typically soldered or sintered on a power electronic substrate that carries the power semiconductors, provides electrical and thermal contact and electrical insulation where needed. Features   · WB Module / fc Module / PiP Module / PoP module · Custom package available · Automotive process flow for uPower Module · Thick uPower Module · Coreless uPower Module · Ag sintering · MIS (Molded Interconnected Substrate) · Substrate (Laminate / Leadframe) · System integrated Package · Green Solution · Super Large Strip (240.5 X 74.12 mm)   Key Features  Package Size (mm)  3x3 ~  Lead Count available  20 ~ 102  Substrate  2 / 4 / 5 / 6 / 7 layers  Overall Thickness (mm)  Max. 1.8  LGA Pitch (mm)  Min. 0.5

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