Failure Analysis

Product Analysis   Non-destructive Analysis - Real time 2D & 3D X-ray - Scanning Acoustic Microscope - Low & High Power Microscopes - Package Warpage Measurement   Characteristics Analysis - Curve Tracer - Automatic I/O Test System - Digital Oscilloscope - Time-Domain Reflectometer - Semiautomatic Probe Station   Cross Section & De-processing - Ion Polisher - Ion Milling - Precision Grinder - Multi Grinder - Molding Press - Automatic Polisher - Laser Decapsulator - Chemical hood for Manual Deprocessing   SEM/EDX Analysis - Scanning Electron Microscope - Field Emission-SEM - Energy Dispersive X-ray - Coating machine   External Lab. - Micro Structure Analysis: FIB, SEM, TEM - Wafer Level Analysis: EMMI, RIE, FE-SEM - Surface/Material Analysis: Auger, XPS, SIMS, FT-IR, & Others